Sivers Semiconductors announced receiving first-year funding of $6 million from the Northeast Microelectronics Coalition (NEMC) Hub through the U.S. CHIPS and Science Act under the Microelectronics Commons program, executed through the Naval Surface Warfare Center Crane Division and the National Security Technology Accelerator (NSTXL).
The award funds collaboration between Sivers Semiconductors and partners Ericsson, Raytheon, MIT, Boston University, and Northeastern University to accelerate domestic prototyping and expand the nation’s global leadership in microelectronics. This is one of six projects awarded to the NEMC Hub, led by Massachusetts Technology Collaborative (MassTech), under the Microelectronics Commons Program.
Sivers Semiconductors will lead the 5G/6G Technology Program, focusing on beamformer IC and array design for FR3 frequencies (7-15 GHz) to enhance future 5G and 6G networks. The program’s end applications include enhanced mobile communication, support for IoT devices, and advancements in autonomous vehicle technologies, and is potentially renewable across three years.
Vickram Vathulya, CEO, Sivers Semiconductors
This initiative propels Sivers into the forefront of 5G/6G innovation. Our collaboration with partners such as Ericsson and Raytheon will allow us to develop relevant innovative technology and products with dual-use applications across commercial and defense sectors.
Mathias Riback, Head, Ericsson Advanced Technology & Industry U.S.
We are excited to be part of the first tranche of the Microelectronic Commons projects. By leveraging our expertise in telecommunications and semiconductor technology, we aim to be leading the development of 6G infrastructure. This project also reinforces our commitment to bolstering the U.S. technology ecosystem.
