Amkor Technology and TSMC announced the signing of a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona, further expanding the region’s semiconductor ecosystem.
The two companies have a long-standing partnership focused on delivering high-volume, cutting-edge technologies for advanced semiconductor packaging and testing, particularly for high-performance computing and communications markets.
Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor’s planned facility in Peoria, Arizona, which will support TSMC’s advanced wafer fabrication operations in Phoenix. This close collaboration and geographical proximity between TSMC’s front-end fab and Amkor’s back-end facility will help accelerate overall product cycle times for customers.
The companies will jointly define specific packaging technologies, including TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®), to address shared customer needs effectively. This agreement underscores a commitment to providing geographic flexibility in front-end and back-end manufacturing, while supporting the growth of a comprehensive U.S. semiconductor manufacturing ecosystem.
Both Amkor and TSMC envision seamless technology alignment for customers across their global manufacturing networks, ensuring robust supply chains and fostering innovation in the semiconductor industry.
Giel Rutten, President and CEO, Amkor
Amkor is proud to collaborate with TSMC to provide seamless integration of silicon manufacturing and packaging processes through an efficient turnkey advanced packaging and test business model in the United States. This expanded partnership underscores our commitment to driving innovation and advancing semiconductor technology while ensuring resilient supply chains.
Dr. Kevin Zhang, Senior VP of Business Development and Global Sales, and Deputy Co-COO, TSMC
Our customers are increasingly depending on advanced packaging technologies for their breakthroughs in advanced mobile applications, artificial intelligence, and high-performance computing, and TSMC is pleased to work side by side with a trusted longtime strategic partner in Amkor to support them with a more diverse manufacturing footprint. We look forward to close collaboration with Amkor at their Peoria facility to maximize the value of our fabs in Phoenix and provide more comprehensive services to our customers in the United States.
