In an effort to increase Canada’s semiconductor production capacity and efficiency, the Federal Government is investing $8 million from the Strategic Innovation Fund (SIF) toward a $42 million project to upgrade equipment at the Teledyne MEMS facility in Bromont QC.

The investment will help Teledyne develop the next generation of image sensors and expand semiconductor capabilities. The 200mm wafer equipment will produce 1.8 times the number of chips that are produced compared to the 150mm wafer size, resulting in a 40% improvement in productivity and efficiency, according to Sébastien Michel, VP and GM of Teledyne MEMS.

The Canadian Federal Governement announced its plans to invest in the Teledyne MEMS facility in Bromont QC. Source: Teledyne DALSA

“This new tooling will also be the cornerstone for the development of intelligent image sensor technologies in synergy with our advanced micro-fabrication (MEMS) technologies. With the government support, this cutting-edge technology will enhance our competitiveness and ensure the growth of a strategic industry for Canada and Quebec,” said Michel.

The SIF contribution will enable Teledyne to sustain its competitive edge in specialised, high-value imaging components, systems and custom image sensors. Teledyne will also provide Canadian businesses and research centres with access to a unique infrastructure for innovative product development and prototyping.

The project will create 40 new jobs and maintain over 560 highly skilled jobs in Canada. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Teledyne has been operating two wafer fabs in Bromont and Edmonton which build on more than 40 years of expertise. Those fabs are accessible to Canadian SMEs and research centres to develop innovative products and have them prototyped or manufactured in volume production.