ATW SCEC breaks new ground from PV to semiconductor with SC-1600 MCZ furnace
semiconductor

ATW SCEC breaks new ground from PV to semiconductor with SC-1600 MCZ furnace

ATW SCEC breaks new ground from PV to semiconductor with SC-1600 MCZ furnace

ATW Technology subsidiary SCEC has achieved a significant milestone in its expansion into the semiconductor sector, with its SC-1600 MCZ SEMI advanced semiconductor-grade magnetic Czochralski furnace successfully producing its first semiconductor silicon ingot during its debut operation at a strategic international client site. This marks the first successful deployment of an ultra-large MCZ furnace in the semiconductor industry and highlights SCEC’s growing expertise beyond its established presence in photovoltaic applications.

The furnace represents a deliberate step forward for SCEC as it leverages its extensive experience in crystal growth technology to meet the unique challenges of semiconductor manufacturing. Unlike photovoltaic-grade equipment, semiconductor-grade furnaces demand precise defect control, higher levels of automation and exceptional stability. The SC-1600 MCZ incorporates advanced features such as ultra-high-precision dual-axis transmission for exact speed control and enhanced vacuum sealing to achieve lower leakage rates.

The furnace also employs optimized vacuum and temperature control systems, intelligent software and visual monitoring technologies, ensuring stability in crystal growth. These innovations allow for improved control of crystal defects, meeting the stringent quality requirements of semiconductor-grade silicon wafers while maintaining operational reliability.

As the semiconductor industry evolves toward larger wafer sizes and higher efficiency, the SC-1600 MCZ furnace offers clients a solution that balances performance and cost. By enabling precise control over production processes, it helps manufacturers reduce wafer fabrication costs while achieving consistent quality.

LEAVE A RESPONSE

Your email address will not be published. Required fields are marked *