BOISE, Idaho — With the new 2024/25 semester just days away, there are more than just new students on Boise State University’s campus.

On Wednesday, BSU unveiled its new semiconductor machine, the first of its kind for a U.S. University.

“It’s a system to deposit very thin, atomically precise semiconductor films on wafer,” said Dr. David Estrada, a BSU professor of material science and engineering.

The AIXTRON machine is able to grow semiconductor film that is just a few atoms thick through a chemical reaction process. 

“This whole system precisely controls different variables – such as injection, gas flow, temperature, pressure – in order to set conditions so that these semiconductor crystals will assemble on the surface of our wafer,” said Michael Curtis, a PhD student at the university’s material science and engineering program.

The machine can also help the university research and make new materials that can replace silicon in semiconductors.

“This will allow the university to help address challenges that are impacting energy consumption by data centers right artificial intelligence,” Dr. Estrada said. “It’ll help us develop microelectronics that could survive in the extremes of space or in nuclear reactors.”

The first-of-its-kind machine will help bring a unique opportunity for BSU students – and opportunities for Idaho to be on the cutting edge of semiconductor production.

“The ability to have students trained on this type of equipment will support folks like Micron or other semiconductor companies to advance their technologies,” Dr. Estrada said.