semiconductor

eInfochips joins TSMC Design Center Alliance to accelerate semiconductor innovation

desk 1 June 2024

AHMEDABAD: eInfochips, an Arrow Electronics company, on Saturday announced that it has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform. The TSMC DCA program focuses on chip-implementation services and system-level design solutions to help lower design barriers for customers adopting TSMC technology.

Mangesh Kulkarni, vice president and general manager of semiconductor practice at eInfochips, said in a statement,”Our collaboration with the TSMC DCA program signifies a pivotal moment for eInfochips. It reflects our deep expertise and positions us to offer an expanded range of design and testing services, utilizing TSMC’s latest technological advancements.”

Dan Kochpatcharin, Head of Design Infrastructure Management Division at TSMC, said in a statement,”We are pleased to welcome eInfochips to the TSMC Design Center Alliance, and we are confident that eInfochip’s expertise will greatly assist our mutual customers in achieving first-time silicon success. TSMC is committed to collaborating with our OIP ecosystem, including eInfochips, to empower designers in achieving their design goals and quickly bringing their innovation to market.”

With more than 25 years of pioneering experience in ER&D, eInfochips is set to build upon its offering of silicon engineering services through this alliance. The company has been developing next-generation SoCs, ranging from 180nm to 3nm process technologies.

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