1) In June, 2023, the Union Cabinet had approved the proposal of Micron Technology for setting up a semiconductor unit in Sanand, Gujarat2) Construction of this unit is progressing at a rapid pace. First chip expected in 2025
3) The memory and storage products manufactured at the assembly, testing, marking and packaging (ATMP) unit of the Idaho-based company will largely be export-led
4) The facility, likely to be operational by late 2024, is coming up at a total proposed investment of $2.75 billion
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5) While Micron has committed $825 million, the rest will be covered by state and central government subsidies
Tata Electronics Private Limited (TEPL) in partnership with Powerchip Semiconductor Manufacturing Corp (PSMC), Taiwan
1) In February this year, a semiconductor fabrication unit with 50,000 Wafer Starts Per Month capacity was approved by the union cabinet
2) Tata Electronics Private Limited (TEPL) will set up a semiconductor fab in partnership with Powerchip Semiconductor Manufacturing Corp (PSMC), Taiwan
3) This fab will be constructed in Dholera, Gujarat
4) Investment in this fab will be ₹91,000 crores
5) Technology partner PSMC is renowned for its expertise in logic and memory foundry segments
6) PSMC has six semiconductor foundries in Taiwan
7) High performance compute chips with 28 nm technology will be produced here
8) Power management chips for electric vehicles, telecom, defence, automotive, consumer electronics, display, and power electronics, will also be produced here
9) Power management chips are high voltage, high current applications
Tata Semiconductor Assembly and Test Pvt Ltd (TSAT)
1) A semiconductor ATMP unit will be set up in Assam
2) Tata Semiconductor Assembly and Test Pvt Ltd (TSAT) will set up the unit in Morigaon
3) This unit will be set up with an investment of ₹27,000 crores
4) TSAT is developing indigenous advanced semiconductor packaging technologies including flip chip and integrated system in package technologies
5) Capacity: 48 million per day
6) Segments: Automotive, electric vehicles, consumer electronics, telecom, and mobile phones
7) Potential customer: Tesla
CG Power, in partnership with Renesas Electronics Corporation, Japan and Stars Microelectronics, Thailand
1) ATMP unit for specialised chips to be by CG Power, in partnership with Renesas Electronics Corporation, Japan and Stars Microelectronics, Thailand
2) Will be set up in Sanand, Gujarat
3) This unit will be set up with an investment of ₹ 7,600 crores
4) Technology partner Renesas is a leading semiconductor company focussed on specialised chips
5) It operates 12 semiconductor facilities and is an important player in microcontrollers, analog, power, and System on Chip products
6) The unit will manufacture chips for consumer, industrial, automotive and power applications
7) Capacity: 15 million per day
These units will generate direct employment of 20,000 advanced technology jobs and about 60,000 indirect jobs. These units will accelerate employment creation in downstream automotive, electronics manufacturing, telecom manufacturing, industrial manufacturing, and other semiconductor consuming industries.
Kaynes Semicon
1) Mysuru-based Kaynes Semicon fourth company to receive an approval from the Union Cabinet for setting up an OSAT facility
2) To set up in Sanand, Gujarat with a Rs. 3,307 crore investment
3) The capacity of this unit will be 63 lakh chips per day
4) The plant will come up in 46 acres
5) 30% of the investment, which is Rs. 992.1 crore will be made by the company
6) Three global customers: Singapore-based LightSpeed Photonics, a company in the US, and another in Taiwan
7) These companies will provide Kaynes imported wafers while Kaynes handles assembly, testing, and packaging for them
8) Focus areas: Power electronics, industrial applications
9) Technology partners AOI Electronics, Japan, Aptos Technology, Taiwan, and Globetronics Technology, Malaysia will also supply wafers and source their chip requirements from Kaynes
10) Mitsui & Co., to supply raw materials and gases need for chip-making
11) To roll out chips by March 2025
12) Initial production: 200 million chips per annum
13) Target: 1 billion chips per annum within 5 years
14) To feature a R&D centre for package design, wafer-level testing, and system-level testing
Projects in the pipeline
Tower in partnership with Adani
1) ISM awaiting formal proposal from Israel chip maker Tower with Adani as a partner
2) The JV approved by Maharashtra state cabinet
3) Location: Taloja MIDC, Panvel
4) Investment: Rs. 83,947 crore ($10 billion)
5) Product: Analog/mixed signals, semiconductor manufacturing
6) Capacity: 40,000 wafers per month in phase 1 & 80,000 wafers per month after phase 2
7) Employment: More than 5,000 jobs
Suchi Semicon
1) Suchi Semicon will begin production at its Gujarat OSAT in November this year
2) The facility will create up to 1,200 jobs
3) To focus on advanced semiconductor assembly and testing
4) The Surat plant is equipped with Class 10k and 100k cleanroom facilities
5) Spans an initial area of 30,000 square feet
6) The company signed an MoU with the Gujarat government to support economic development and job creation
7) Suchi Semicon has collaborated with Gujarat Technological University and SVNIT to develop a skilled workforce for the semiconductor industry
A joint venture between Foxconn Technology Group and HCL Group, has applied for OSAT
A joint venture between ASIP (Advanced System in Package Technologies) and Korea’s APACT Limited has also applied for OSAT
Tarq Semiconductors, owned by real estate giant Hiranandani Group, has also sought approval for an ATMP facility and a compound semiconductor unit.