India is ‘very seriously’ looking to make a strategic leap in semiconductor technology by investing in the research and development of two-dimensional (2D) materials, a CNBC TV18 report stated citing sources. 

Why 2D materials could change the game?

While the bulk of current chip manufacturing relies on traditional silicon wafers, 2D materials are ultra-thin substances (only a few atoms thick) and offer the promise of exponentially smaller, faster, and more power-efficient chips. These next-generation materials, including graphene, phosphorene, and transition metal dichalcogenides (TMDs), are being studied globally for their potential to revolutionize chip design.

“2D materials are being viewed as a major frontier in semiconductors globally, and the government wants India to get in early,” a senior official familiar with the matter told CNBC TV18.

Unlike conventional 3nm chips used today by tech giants like Apple, Samsung, MediaTek, and Intel, the report maintained, chips built with 2D materials could break through the physical and performance limitations of silicon. Currently, however, no company or country has successfully commercialised chips made from 2D materials. However, according to the report, research is underway in China, the US, the UK, Germany, and Japan. 

Government plans EoI for research, pilot projects

According to the sources, a call for Expressions of Interest (EoIs) will soon be issued to both academia and industry, inviting proposals for R&D initiatives and pilot fabrication facilities dedicated to 2D material technologies.

“The government will assess readiness levels from both academic institutions and industry players. Based on the proposals and ecosystem maturity, funding options are also on the table,” another official told the publication.

The move aligns with India’s broader goal of becoming a hub for semiconductor manufacturing while also acknowledging that a long-term edge may lie beyond current fab capabilities.

Sources also told CNBC TV18 that a team of scientists from the Indian Institute of Science (IISc) submitted detailed proposals in both 2022 and 2024 to develop chip architectures using 2D materials.