India News | PM to Virtually Lay Foundation Stone for Semiconductor Facility in Assam on Wednesday | LatestLY
semiconductor

India News | PM to Virtually Lay Foundation Stone for Semiconductor Facility in Assam on Wednesday | LatestLY

Guwahati, Mar 13 (PTI) Prime Minister Narendra Modi will virtually lay the foundation stone for a Rs 27,000-crore semiconductor assembly and test facility in Assam’s Morigaon district on Wednesday.

Chief Minister Himanta Biswa Sarma will be present at the event.

Also Read | Mumbai: Mother Kills Daughter for Dating Drug Addict, Tries to Pass Off as Death Due to Severe Asthma Attack; Arrested.

‘Hon’ble Prime Minister Shri@narendramodi: People of Assm eagerly await this game-changing project-which has moved from conception to implementation in a record time period. Yet another testimony to the limitless possibilities that your governance offers,” the chief minister posted on ‘X’.

The greenfield project of Tata Electronics at Jagiroad will involve an investment of Rs 27,000 crore and will generate employment opportunities for more than 30,000 people.

Also Read | Bengaluru Shocker: Decomposed, Naked Body of Woman Found in Residential Building in Chandapura; Police Suspect Foul Play.

The first phase of the facility is expected to be operational by mid-2025.

“Tomorrow marks a new dawn for Assam and the North East. Once known for being a hotbed of insurgency, we are transforming into an epicentre of big bang investment and projects,” Sarma said on the microblogging site on Tuesday.

The company will build the facility focusing on three key platform technologies – Wire Bond, Flip Chip, and a differentiated offering called Integrated Systems Packaging (ISP), with plans to expand the roadmap to advanced packaging technologies in the future.

(This is an unedited and auto-generated story from Syndicated News feed, LatestLY Staff may not have modified or edited the content body)

LEAVE A RESPONSE

Your email address will not be published. Required fields are marked *