Vijayawada: Andhra Pradesh govt signed an MoU with Indichip Semiconductors Limited and its joint venture (JV) partner Yitoa Micro Technology Limited (YMTL) of Japan for setting up a semiconductor manufacturing facility with an investment of over Rs 14,000 crore. This Silicon Carbide (SiC) chips manufacturing facility will be India’s first private semiconductor fab.
The SiC fab facility will begin with a production capacity of 10,000 wafers per month, ramping up to 50,000 wafers within 2-3 years. The state govt recently announced a separate policy for semiconductor manufacturing with a view to making Andhra Pradesh a hub of semiconductor manufacturing.
The MoU was signed between Piyush Bichhoriya, managing director of Indichip, and Saikanth Varma, the CEO of Andhra Pradesh Economic Development Board, in the presence of minister for information technology, electronics and HRD, Nara Lokesh, minister for industries TG Bharath, and representatives from Indichip and YMTL.
“This investment is a testament to Andhra Pradesh’s ability to attract cutting-edge industries through innovative policies and robust infrastructure. Our focus on nurturing talent and providing seamless support will ensure the success of this initiative and strengthen India’s global semiconductor footprint,” said Lokesh.
The state govt will allot land in Orvakal Mega Industrial Hub, Kurnool. The state govt will provide the necessary infrastructure and ecosystem for grounding the unit as soon as possible.