Sachin Tendulkar-backed RRP Electronics has entered into a strategic alliance with US-based Deca Technologies Inc, to enhance its semiconductor capabilities.
As per the agreement, RRP Electronics – a company focused on assembling and testing semi conductor components – will use Deca’s cutting-edge wafer-level packaging solutions to enhance its semiconductor capabilities.
RRP will integrate Deca’s WLCSP and M-Series FOWLP technologies with the company’s assembly and testing processes.
Deca is a leading technology development and licensing company in the advanced packaging industry and is backed by leading industry investors such as Qualcomm, Infineon and ASE Group.
Currently, RRP has collaboration for production of sophisticated ASICs in QFN packages for a Swiss customer.
Rajendra K Chodankar, Chairman and CEO, RRP Electronics said the company will invest in Technology Transfer License Agreement with exclusive terms for the complete automated infrastructure.
The present infrastructure will also significantly contribute to the Deca ecosystem, he said.
The company expects to start operations in August after qualification test. This collaboration has the potential to generate revenue of about ₹260 crore in the second year of operation, it said.
Tim Olson, Founder and CEO, Deca Technologies said the alliance will accelerate RRP Electronics ambitious plans and help India emerge as a prominent player in the semiconductor space.
RRP Electronics is developing the Outsourced Semiconductor Assembly and Test (OSAT) initiative with a total investment of ₹24,000 crore. The OSAT initiative, aims to establish a modern semiconductor plant manufacturing and assembly facility in Maharashtra.
RRP Electronics is being supported by Maharashtra government to foster technological advancements and economic growth in the region.
Last September, RRP inaugurated its facility with advanced manufacturing equipment. The project is expected to create about 4,000 jobs.
