Sivers Semiconductors, a global leader in photonics and wireless technologies, announced that it has signed a strategic Memorandum of Understanding (MOU) with a leader in optical infrastructure solutions for large-scale AI workloads to enable volume production of high-performance laser arrays.

With hyperscalers and next-generation datacenters struggling with power constraints, bandwidth limitations and rising operational costs, the shift from copper to optical I/O interconnects has become critical. Optical solutions offer the necessary bandwidth, efficiency, and scalability to meet the growing demands of modern AI workloads and data-intensive applications.

Sivers Semiconductors continues to push the envelope on laser array sizes and power levels. The company’s innovative technology enables the broadest range of infrastructure configurations for upcoming AI datacenter deployments.