Chairman Chey Tae-won of SK Group and President Kwak No-jung of SK Hynix recently met with key figures from TSMC in Taiwan to discuss strengthening cooperation in AI semiconductor competitiveness. This high-profile meeting included discussions with TSMC Chairman Wei Zhejia and other leaders in Taiwan’s IT industry on June 6, focusing on enhancing collaboration in the high-bandwidth memory (HBM) sector.

The meeting follows a series of strategic moves by SK Group to bolster its position in the global semiconductor market. In April, SK Hynix signed a memorandum of understanding (MOU) with TSMC to advance the development of HBM4 (6th generation High Bandwidth Memory) and improve advanced packaging technology capabilities. This agreement aims to leverage TSMC’s leading-edge logic process for base die production, which is expected to significantly enhance HBM4 performance. SK Hynix plans to commence mass production of HBM4 by 2025, optimizing the combination of its HBM technology with TSMC’s CoWoS® technology to meet customer demands.

Chairman Chey’s efforts to forge global partnerships have been ongoing since the end of last year. In December, he visited ASML’s headquarters in the Netherlands to discuss technology cooperation, including hydrogen gas recycling technology for EUV (Extreme Ultraviolet) lithography equipment and next-generation EUV development. In April, Chey met with NVIDIA CEO Jensen Huang at NVIDIA’s headquarters in San Jose, USA, to explore ways to strengthen the partnership between SK Hynix and NVIDIA.

During the recent meeting in Taiwan, Chairman Chey emphasized the importance of opening a new era of AI that benefits humanity, stating, “Let’s lay the foundation for an AI era that benefits humanity together.” This sentiment underscores SK Group’s commitment to advancing AI technologies through strategic global collaborations.

An SK Group official highlighted the significance of these efforts, noting, “Chairman Chey’s recent activities are based on the judgment that establishing a global cooperation network is crucial for strengthening the competitiveness of Korea’s AI/semiconductor industry and SK’s business.”

The semiconductor industry is a critical component of the global technology landscape, with Taiwan playing a pivotal role in the supply chain. Companies like TSMC provide essential foundry services, manufacturing semiconductors for firms that design but do not fabricate their own chips. High Bandwidth Memory (HBM) is particularly important for high-performance computing and AI applications, making the collaboration between SK Hynix and TSMC a significant development.

SK Group’s strategic partnerships, including those with ASML and NVIDIA, reflect its commitment to staying at the forefront of technological innovation. These collaborations are not only vital for SK’s business growth but also for enhancing the global competitiveness of South Korea’s semiconductor industry.

As SK Hynix and TSMC move forward with their plans, the industry will be watching closely. The successful mass production of HBM4 by 2025 could set new benchmarks in semiconductor performance, driving advancements in AI and other high-tech fields. Chairman Chey’s vision of a globally interconnected ecosystem for AI and semiconductors is gradually taking shape, promising significant benefits for the industry and beyond.