March 21, 2025 – The federal Strategic Innovation Fund is contributing $8 million toward a $42-million upgrade project at Teledyne’s Bromont, Que., facility.

Teledyne is upgrading its facility to support next-generation image sensors and semiconductor capabilities.

“The project announced today marks a crucial step for Teledyne Digital Imaging […]” said Teledyne MEMS vice-president and general manager Sébastien Michel. “Thanks to significant investments, the expertise in design and manufacturing of image sensors developed by Teledyne over the past 30 years will be transferred to a new manufacturing line using 200 mm silicon wafers.”

According to the federal Department of Innovation, Science and Economic Development Canada (ISED), the SIF contribution will enable Teledyne to sustain its competitive edge in specialized, high-value imaging components, systems and custom image sensors.

The upgrade will support the conversion of the charge-coupled device (CCD) production line from 150 mm to 200 mm, which will produce 1.8x the number of chips compared to the 150 mm wafers.

“This new tooling will also be the cornerstone for the development of intelligent image sensor technologies, in synergy with our advanced micro-fabrication (MEMS) technologies,” Michel added.

ISED explains that CCD technology is used to manufacture specialized image sensors and cameras, such as those used in space or for advanced industrial inspection. Furthermore, Teledyne’s Bromont facility is one of the few CCD fabrication facilities still in operation in the world.

Teledyne will also provide Canadian businesses and research centres with access to infrastructure for product development and prototyping, added the department.

The project is expected to create 40 new jobs and maintain more than 560 skilled positions.

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