TI converts Japanese 200mm fab to GaN, quadruples capacity
semiconductor

TI converts Japanese 200mm fab to GaN, quadruples capacity

Together with production at Dallas, Texas, this will quadruple TI’s GaN manufacturing capacity and allow it to reduce dependence on outsourced supply. TI said it expects to be able to make 95 percent of its GaN chips internally by 2030.
TI has a …

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