Training the Next Generation of Semiconductor Manufacturing Pros
semiconductor

Training the Next Generation of Semiconductor Manufacturing Pros

July 26, 2024

TMC Banner Ad

 

Over the past few years, the U.S. has made significant strides in semiconductor manufacturing, driven by substantial investments and strategic policies. With the CHIPS Act expected to triple domestic semiconductor manufacturing capacity by 2032, the need for a skilled workforce is more urgent than ever. This discussion explores the key question: What does the industry need to support the next generation of professionals, and where are the talent gaps?

In this episode of Experts Talk, host Daniel Litwin is joined by guests Rob Picken, SVP of Digital Transformation at Sourceability; Gustavo Sepulveda, Process Automation Business Head at Panasonic Connect North America; Mark Granahan, Co-Founder and CEO of iDEAL Semiconductor; and Beth Keser, Ph.D., VP of Manufacturing Technology at Zero ASIC.

Key Points of Discussion:
Projected Growth: The U.S. aims to significantly increase its semiconductor manufacturing capacity by 2032, driven by the CHIPS Act and substantial private investments.
Skill Gaps: Identifying and addressing specific skill gaps in the current workforce is critical to meeting the projected growth in semiconductor manufacturing.
Education and Training: Effective training pipelines and continuous education models are essential for preparing the workforce for the industry’s future demands.

Rob Picken is the SVP of Digital Transformation at Sourceability, with a focus on helping customers make sense of the open market through data and informatics. Gustavo Sepulveda is the Process Automation Business Head at Panasonic Connect North America, dealing with semiconductor manufacturing challenges. Mark Granahan is the Co-Founder and CEO of iDEAL Semiconductor, a startup focusing on staffing requirements for the semiconductor industry. Beth Keser, Ph.D., is the VP of Manufacturing Technology at Zero ASIC and the past president of IMAPS, with extensive experience in semiconductor packaging.

Article written by MarketScale.

LEAVE A RESPONSE

Your email address will not be published. Required fields are marked *