UK chipmaker EnSilica has unveiled a new partnership with Taiwan’s biggest semiconductor business in a bid to turbocharge the development of its innovative technology.

The Berkshire-based developer of application specific integrated circuits (ASICs) said it had joined the Design Center Alliance of the Taiwan Semiconductor Manufacturing Company’s Open Innovation Platform.

The platform seeks to reduce design barriers and improve first-time silicon success, promoting the speedy implementation of innovation among semiconductor designers, enabling them to ramp up performance and power efficiency for next-generation AI and mobile application chips.

EnSilica said the partnership  “strengthens EnSilica’s value in enabling the next-generation of system-on-chips, ranging from mixed signal devices for industrial and automotive applications to communications and edge artificial intelligence chips using TSMC’s most advanced process technologies.”

EnSilica CEO Ian Lankshear said: “Joining the TSMC DCA programme marks a significant achievement for EnSilica. Our deep expertise in mixed signal and RF design, combined with TSMC’s advanced technology, positions us to deliver unparalleled solutions to our mutual customers.”

 Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC, added: “TSMC is committed to collaborating with our OIP ecosystem partners, including EnSilica, to empower customers in achieving their design goals and quickly bringing their innovation to market.”

This story is being updated, more to follow